Gap Filler Pads

Thermal interface materials, like gap filler pads, play a critical role in themal management in electronic devices. 

Composed of materials with high thermal conductivity, such as silicone or elastomers, these pads fill gaps between components and heat sinks. Thermal Interface Materials (TIM) are a secondary material installed between the heatsink and the device which are designed to improve the thermal transfer to the heatsink. Regardless of how flat or smooth the device and heatsink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids.

Available in various thicknesses, gap filler pads accommodate different gap sizes, offering customization. Beyond thermal conductivity, some pads provide shock absorption, making them versatile for applications with mechanical stress or vibrations. Easy to apply and durable, these pads contribute to the overall efficiency and longevity of electronic devices.