Wakefield Thermal
Thermal Management
Wakefield Thermal has been in continuous operations since 1952, providing thermal solutions across multiple industries.
Industries served include Power Conversion, Information Technology, Renewable Energy, Telecommunications, Transportation, Aerospace/Defense, LED Lighting, Factory Automation, Consumer, and Medical.
The thermal solutions Wakefield Thermal manufactures comprise a wide array of products, including thermal extrusions, LED heat sinks, heat frames and heat pipes, fans, heat exchangers, coolant distribution units, liquid cold plates, etc., making Wakefield Thermal unique in its ability to deliver the increasingly complex thermal solutions required to meet the thermal engineering challenges of today’s ever-higher electronics packaging densities
Heat Pipes & Vapor Chambers
High-quality heat pipes and vapor chambers for thermal management applications. Wakefield Thermal’s heat pipes and vapor chambers are designed to efficiently transfer heat from high-performance electronic systems, power electronics, and electric vehicles.
Liquid Cooling Plates
Liquid cooling plates for thermal management applications, including products from trusted suppliers such as Vette Thermal. Liquid cooling plates are made with high-quality materials and designed for efficient heat dissipation in high-performance electronic systems, power electronics, and electric vehicles.
Heat Sinks & Heat Spreaders
Heat sinks and heat spreaders from Wakefield Themal for various thermal management needs.
Heat sinks and heat spreaders come in various shapes and sizes, including extruded heat sinks, folded fin heat sinks, and bonded fin heat sinks, to cater to different application requirements. We also offer custom heat sink designs to ensure optimal thermal performance and reliability for specific projects.
Thermal Interface Materieals
Thermal Interface Materials (TIM) are secondary materials installed between the heatsink and the device that are designed to improve the thermal transfer to the heatsink. Regardless of how flat or smooth the device and heatsink are, there will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case usages.
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