Thermal Management
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Why Do We Need Thermal Management
With the growing reliance on high-powered devices and systems, the amount of heat they can generate during their peak operations can significantly reduce their life and performance efficiency. Therefore, there is a need for effective thermal management to ensure that the temperature thresholds of devices and systems remain within a safe range. In this page, we will take a comprehensive look at thermal management, its working concepts, and all other key details you should know about.
What is Thermal Management?
Thermal management is the capability to control a system’s temperature through technology based on heat transfer and thermodynamics concepts. In simple words, thermal management implies practicing all processes and methods to decrease (or increase) the temperature of a targeted system.
The technological advancements and boom in the industrial sector, especially in the electronics industry, demands innovative thermal management technologies to ensure system reliability and enhance system performance. That’s the reason we can see lots of innovative and new approaches to thermal management being practiced today.
Product Types of Thermal Management and their Working Principle
There are many thermal management products to pick from. They can be used separately, but it is preferred to set up an integrated thermal management system for maximum efficiency and heat dissipation. Following are the most widely used product types:
Fans & Accessories
Fans make the air around the device constantly flow, thereby taking away the heat generated by the device. They are available in different types depending on the size, performance, noise, quality, and cost factors. Some of them even come with speed control for enhanced operations. They are usually inexpensive but require a continuous power supply to operate.
Heat Pipes & Vapor Chambers
Heat pipes and vapor chambers both use the identical two-phase cooling process. From the heat source, the liquid evaporates and turns into vapors. Those vapors travel via the cavity of the heat pipe or vapor chamber towards the cooler side of the pipe or chamber and then condense. Through capillary action, the newly formed condensed liquid goes back to the hot area via the wick. The main difference between heat pipes and vapor chambers is that the former transfers heat only along the axis of the heat pipe, while the latter can spread heat in several directions.
Thermal Interface Material (TIM)
Thermal Interface Material (TIM) is used to ensure effective heat dissipation between two or multiple solid surfaces. TIM is one of the crucial elements of any efficient thermal management system. Since the presence of air between components can accumulate heat, so TIM is used to close such air gaps mainly caused due to roughness, unevenness, or tolerance. Modern TIM is available in different product types, such as gap filler pads, phase change materials, thermal putty and grease, non-silicone gap filler, etc.
Liquid Cooling Plates
Liquid cooling plates stand as one of the most efficient ways of removing heat. In this thermal management approach, you put cool liquid in the water block inlet. The liquid then travels through the various water block chambers and absorbs the heat from the electronics or other surfaces. Afterward, the warmer liquid exits the water block. The liquid can be water, glycol mixtures, liquid refrigerants, hydraulic fluid, gasoline, oil, etc.
Heat Sinks & Heat Spreaders
Heat sinks and heat spreaders are also widely used thermal management products. Heat sinks are usually aluminium and/or copper parts with many fins or pins that are attached to the object to dissipate the heat. The high thermal conductivity of these materials coupled with high surface area results in faster transfer of heat.
On the other hand, heat spreaders are large, flat surfaces made of high thermal conductive material to act as a mediator between transferring heat from the hotter object to the cooler object of a larger cross-sectional area.
Thermoelectric cooling / Peltier coolers
We offer Thermoelectric cooling/Peltier coolers for heat-pumping, thermal cycling and precise temperature control from Ferrotec. These premium quality thermoelectric modules is used by several business areas, from telecom and biomedical to automotive and consumer devices for example.
How does Thermal Management Work?
Thermal management technologies basically work around three basic modes of heat transfer, i.e., conduction, convection, and radiation. All these three modes are used to cool the systems, but their working principle varies, as explained below:
Conduction
Conduction is a way of transferring thermal/heat energy through physical contact. The two objects are touched together so that the object with a lower temperature can absorb the thermal energy from the hotter one.
Conduction is known as one of the most effective approaches of thermal management because it requires a minimal surface area to do the energy transfer operation.
Typical examples of conduction-based thermal management products include heat sinks, heat spreaders, etc.
Convection
Convection is a way of dissipating thermal/heat energy by the flow of cooler air. Since hot air has a natural tendency to rise, so cool air is flowed through the warmer device to draw heat from it and then take it away.
It can be done either using natural airflow (passive solution) or by fans to increase the airflow for more heat dissipation (active solution). Convection is less effective compared to conduction, but it still does the job effectively, mostly seen as the final process in a thermal management system.
Typical examples of convection-based thermal management products include fans, blowers, etc.
Radiation
Radiation is a way of transferring thermal/heat energy through electromagnetic waves that are created with the vibration of hot particles.
When charged particles move and interact, they generate magnetic and electric fields that convert heat’s kinetic energy into electromagnetic energy that spreads/dissipates from the main source.
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Frequently asked questions and answers about Thermal Management
What types of heat pipes Wakefield-Thermal offers?
Wakefield Thermal offers several types of heat pipes, including standard heat pipes, vapor chamber heat pipes, and loop heat pipes. These heat pipes are designed for efficient thermal management in various applications, such as cooling high-performance electronics, aerospace systems, and industrial machinery.
When to use a heat pipe?
Use a heat pipe for thermal management when you need efficient heat transfer in applications such as cooling electronics, aerospace systems, or industrial machinery. Heat pipes are ideal for managing high heat flux, ensuring reliable performance and longevity of components.
What types of fans are commonly used for thermal management in industrial applications?
The most common types of fans used for thermal management in industrial applications are axial fans and radial fans. Axial fans are effective for moving large volumes of air with low pressure, while radial fans are better suited for generating higher pressure in more confined spaces. Both AC fans and EC fans are utilized, but EC fans are increasingly popular due to their energy efficiency and precise control.
Thermal grease or solid materials: What are the pros and cons?
When it comes to thermal management, both thermal grease and solid materials have their advantages and disadvantages. Thermal grease offers excellent heat conductivity and fills microscopic gaps between surfaces, ensuring optimal contact. However, it can be messy to apply and may need reapplication over time. Solid materials, such as thermal pads or phase change materials, provide a cleaner and more stable solution, but they might not fill gaps as effectively as grease. Choosing between them depends on the specific requirements of your thermal management application.
What does TIM mean in thermal management?
In thermal management, TIM stands for Thermal Interface Material. These materials are used to enhance heat transfer between surfaces, such as a CPU and a heat sink. TIMs fill microscopic air gaps and irregularities, ensuring efficient thermal conductivity and optimal cooling performance in electronic devices.
When should you use a cold plate in thermal management?
Cold plates are utilized in thermal management when efficient heat dissipation is required for cooling electronic components or devices. They are commonly used in applications where direct contact cooling is necessary, such as cooling power electronics, CPUs, lasers, and LED modules. Cold plates offer effective heat removal by circulating a coolant through channels within the plate, making them ideal for applications with high heat flux or limited space for traditional cooling methods.
What are the common types of cooling profiles for heat sinks?
In thermal management, heat sinks come in various profiles designed to efficiently dissipate heat from electronic components. Common types include finned, pin, and plate heat sinks. Finned heat sinks feature fins that increase surface area for better heat dissipation. Pin heat sinks have an array of pins that facilitate airflow and heat transfer. Plate heat sinks provide a flat surface for direct contact cooling. Each type offers unique advantages depending on the specific thermal management requirements of the application.
What are the fan accessories used for thermal management?
Fan accessories such as fan guards, air filters, and shock-absorbing rubber mounting devices (Toptec) are essential for efficient thermal management. Fan guards protect fingers and other objects from the rotating fan blades, ensuring safety. Air filters prevent dust and debris from entering the system, maintaining optimal airflow. Shock-absorbing rubber mounting devices facilitate easy and secure installation of fans, reducing vibration and noise. These accessories enhance the performance and longevity of cooling systems in various applications.
