We can offer all standard types of heat sinks – machined and customized on demand.
High quality and precision at competitive pricing. We supply heat sinks with pre-assemblemed thermalinterface material on request. Produced in Europe or Far East.
Machined Extrusion
A very wide range of capabilities in manufacturing machined heat sinks from standard or custom extrusion profiles, in small, medium, large, or very large quantities.
Designed unique to fit your needs, extruded heatsinks are your most common solution for thermal management.
They are manufactured by pushing hot aluminum billets through a steel die to produce the final shape. The most common aluminum alloy is 6063-T5, but other 6XXX alloys can also be examined as needed.
When the material is extruded, the initial sticks are 30-40 feet in length and are very soft. The material is stretched by grabbing both ends to produce a straight stick. After stretching, the material can be either air or over aged depending upon the required final hardness of the material.
After the aging process, the material is cut to the final length and any final fabrication (holes, pockets, or other secondary machining) can be done.
Designed with a stamping or extrusion for common package sizes to improve thermal performance
Board Level heat sinks are named as such because they are generally attached both to the device and the PCB. Usually constructed as either a stamping or an extrusion, these heat sinks are designed for common package sizes like T0220, T0247, and D2pak.
Stamped heat sinks can have features that clip on to the device so that a screw or secondary clip is not required. Stamped heat sinks have bent/twisted fins to improve the thermal performance in either natural or forced convection. Aluminum stampings are anodized for improved performance in natural convection.
If the heat sink is to be mounted to the PCB, then a solderable tab or pin can be attached to the heat sink.
These heatsinks are made for a divers set of applications. They are mounted to BGA devices, but are actually just simple extrusions.
BGA heat sinks are usually crosscut to convert the extruded fins into pins which allow them to be used in more diverse applications. The number and size of the crosscuts are dependent upon the environment.
Because BGA heat sinks are generally small, the attachment of the heat sink is a challenge.
The heat sinks can be either attached to the device or to the PCB depending upon the application and the mechanical requirements.
LED Heat Sinks are small but powerful heatsinks made to fit a variety of lighting such as household, industrial, and automotive.
LED applications are thermally challenging because of their small size, high power dissipation, complex environment, and cost restrictions. LEDs are small in size and can be clustered together to produce more/brighter light.
Their small size means that the spreading of the heat from the LED into the heat sink is extremely important. To improve the spreading, many LEDs are mounted to metal-clad PCBs.
While LEDs are electrically efficient, they are only about 30% efficient from a thermal perspective, which leads to thermal challenges.
Copper or aluminum extrusion technology for fin density not achieved by regular extrusion heatsinks.
Skived Fin heatsinks can be an alternative to extruded heatsinks when looking for a fin density that can’t be achieved by extrusion technology. Skived heatsinks can be manufactured from either copper or aluminum and usually have 0.5 (0.020”) thick fins.
Skived heatsinks are produced using a series of sharp knives that, as they pass over the material, curl up a small thickness of metal which is then bent vertically to form the fin. Skived fins are produced from a bar of material which is approximately 16 feet in length and then cut to length as required by the final application.
The high power, cost effective, and reliable solution for natural or forced convection.
Bonded fins are a good high power solution for either natural or forced convection. Individual straight fins are cut and bonded into a grooved base plate. The fins are usually thicker than you would find on a zipper/skived or folded fin, so they have the ability to be more efficient, even at tall heights. Aluminum and copper fins can be combined on the same heat sink to provide improved performance without all of the weight gain. If weight is especially important, graphite fins can also be used, but they are more delicate so extra care must be taken.
Configurable in a variety of ways, bonded fins are reliable, cost effective, and highly efficient thermal management solutions for high power and densely packaged applications, even in demanding shock and vibration environments. Bonded fin heat sinks are used when the required combination of large heat sink size, tall fins, and high fin density make simple extrusions impractical.
Quarter-brick, full-brick and half-brick configurations that keep your DC/DC converter cool.
The DC/DC Converter Heat Sinks from Wakefield Thermal come in three main configurations: Quarter-Brick, Full-Brick, and Half-Brick. All three feature a set of qualities that help to keep your DC/DC converter cool and operating at its best to drive power to your electronics.
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At EG Electronics, we specialize in high-performance heat sinks and heat spreaders designed to efficiently manage heat in electronic and industrial systems. Effective thermal management is essential for preventing overheating, maintaining device performance, and extending component lifespan. Our products range from compact solutions for small electronics to large, high-capacity heat sinks for industrial applications, ensuring that excess heat is effectively dissipated.
At EG Electronics, our heat sinks are built using advanced materials like aluminum and copper, which are highly valued for their superior thermal conductivity and lightweight properties. These materials enable rapid heat transfer from electronic components, effectively preventing overheating and ensuring consistent performance.
Aluminum is widely used for its excellent balance of conductivity, weight, and durability. Its lightweight nature makes it ideal for applications where weight reduction is essential, such as in automotive or aerospace electronics. Aluminum heat sinks allow for efficient, low-weight cooling solutions without compromising durability or thermal performance.
Copper is highly conductive, making it an excellent choice for applications requiring rapid heat dissipation and thermal stability. Copper heat sinks are ideal for high-power applications, where maintaining lower temperatures is critical, such as in data centers and heavy industrial machinery. Though heavier, copper’s performance in transferring heat efficiently makes it a go-to material for advanced thermal solutions.
Our heat sinks are engineered with optimized fin structures that increase surface area, thereby maximizing airflow and heat transfer. The fins are designed to direct airflow efficiently, allowing for effective dissipation even in enclosed spaces or demanding environments. This structure reduces thermal resistance, helping electronic components maintain safe operating temperatures.
With durable designs that withstand thermal cycling and harsh conditions, our heat sinks provide reliable thermal management across various applications, from LED lighting and automotive electronics to industrial power systems. Each product undergoes rigorous testing to ensure it meets high standards for durability, efficiency, and consistent performance.
At EG Electronics, our heat sink solutions are designed to meet the diverse thermal management needs of industries such as LED lighting, automotive electronics, telecommunications, and power electronics. Whether a project requires a standard solution or a custom design, we have options that ensure optimal heat dissipation and performance across all applications.
For common applications, we provide a range of standardized heat sinks that deliver reliable thermal performance with rapid deployment. These solutions are ready to integrate into existing systems, allowing for immediate, effective heat management without the need for extensive customization. Ideal for LED lighting and general electronic devices, our standard heat sinks balance cost-effectiveness with high efficiency.
In situations where unique specifications are essential, our custom-designed heat sinks are tailored to meet precise thermal, spatial, and material requirements. Our design team works closely with customers to create bespoke solutions that maximize heat dissipation, whether for compact, high-performance devices or complex industrial systems. From specialized mounting configurations to custom dimensions and surface treatments, our custom heat sinks are crafted to fit seamlessly within your specific setup.
For applications with concentrated heat sources, such as power electronics and sensitive telecommunications equipment, our heat spreaders provide an effective solution. By distributing heat across a larger surface area, heat spreaders reduce localized hot spots, ensuring that temperature-sensitive components remain within safe operating limits. This method is particularly beneficial in applications where traditional heat sinks may not provide sufficient cooling due to space or power constraints.
Our heat sinks and heat spreaders are developed for easy integration, with options for various attachment methods, including thermal adhesive tapes, clips, and screws. These versatile installation options make our products suitable for rapid assembly in manufacturing environments, where flexibility and ease of installation are key.
Discover how our versatile heat sinks and heat spreaders can support your application’s thermal needs.
Explore our complete heat sink and heat spreader portfolio and learn how our thermal management solutions can enhance the reliability of your systems.
A heat sink dissipates heat away from electronic components, helping to maintain safe operating temperatures and prevent overheating.
Aluminum and copper are the most common materials, chosen for their high thermal conductivity and durability.
A heat spreader distributes heat across a broader surface area, reducing hot spots and protecting sensitive components in high-density applications.
Heat spreaders are ideal for compact or high-power applications where space is limited and effective thermal dissipation is needed.
Yes, EG Electronics offers custom-designed heat sinks to meet specific size, material, and performance needs.
Consider factors like heat dissipation needs, component size, operating environment, and mounting options. Consulting a thermal management specialist can help you find the optimal solution.
